JPH0544794Y2 - - Google Patents

Info

Publication number
JPH0544794Y2
JPH0544794Y2 JP1987169704U JP16970487U JPH0544794Y2 JP H0544794 Y2 JPH0544794 Y2 JP H0544794Y2 JP 1987169704 U JP1987169704 U JP 1987169704U JP 16970487 U JP16970487 U JP 16970487U JP H0544794 Y2 JPH0544794 Y2 JP H0544794Y2
Authority
JP
Japan
Prior art keywords
chip
terminal
terminals
circuit board
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987169704U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0174595U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987169704U priority Critical patent/JPH0544794Y2/ja
Priority to GB8804409A priority patent/GB2203270B/en
Priority to US07/164,299 priority patent/US5008868A/en
Priority to CH848/88A priority patent/CH678256B5/fr
Priority to KR1019880003776A priority patent/KR910008672B1/ko
Priority to CN88104877A priority patent/CN1016289B/zh
Publication of JPH0174595U publication Critical patent/JPH0174595U/ja
Application granted granted Critical
Publication of JPH0544794Y2 publication Critical patent/JPH0544794Y2/ja
Priority to SG41694A priority patent/SG41694G/en
Priority to HK40894A priority patent/HK40894A/xx
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electromechanical Clocks (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Clocks (AREA)
JP1987169704U 1987-03-05 1987-11-06 Expired - Lifetime JPH0544794Y2 (en])

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP1987169704U JPH0544794Y2 (en]) 1987-11-06 1987-11-06
GB8804409A GB2203270B (en) 1987-03-05 1988-02-25 Timepiece assembly.
US07/164,299 US5008868A (en) 1987-03-05 1988-03-04 Structure for mounting an integrated circuit
CH848/88A CH678256B5 (en]) 1987-03-05 1988-03-07
KR1019880003776A KR910008672B1 (ko) 1987-11-06 1988-04-04 타임피스용 ic 칩 장착구조물
CN88104877A CN1016289B (zh) 1987-11-06 1988-08-06 钟表上集成电路芯片的安装结构
SG41694A SG41694G (en) 1987-03-05 1994-03-22 Timepiece assembly
HK40894A HK40894A (en) 1987-03-05 1994-04-28 Timepiece assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987169704U JPH0544794Y2 (en]) 1987-11-06 1987-11-06

Publications (2)

Publication Number Publication Date
JPH0174595U JPH0174595U (en]) 1989-05-19
JPH0544794Y2 true JPH0544794Y2 (en]) 1993-11-15

Family

ID=31460000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987169704U Expired - Lifetime JPH0544794Y2 (en]) 1987-03-05 1987-11-06

Country Status (1)

Country Link
JP (1) JPH0544794Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059869A (ja) * 2010-09-08 2012-03-22 Toyobo Co Ltd 固定部材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219990Y2 (en]) * 1979-06-05 1987-05-21
JPS5661062U (en]) * 1979-10-16 1981-05-23
JPS6126194U (ja) * 1984-07-23 1986-02-17 セイコーエプソン株式会社 電子時計の回路構造

Also Published As

Publication number Publication date
JPH0174595U (en]) 1989-05-19

Similar Documents

Publication Publication Date Title
US5413970A (en) Process for manufacturing a semiconductor package having two rows of interdigitated leads
KR100370308B1 (ko) 반도체웨이퍼의탐침검사방법
JPH0621173A (ja) 試験専用接点を有する半導体デバイスの製造方法
KR0185570B1 (ko) 칩 스케일 패키지의 제조 방법
US6270356B1 (en) IC socket
JPH0544794Y2 (en])
KR20010111118A (ko) 프로브 카드
KR20100045079A (ko) 검사용 탐침 장치 및 그 제조 방법
JPH1117058A (ja) Bgaパッケージ、その試験用ソケットおよびbgaパッケージの試験方法
KR20130071816A (ko) 반도체(ic)용 테스트 유닛
KR20020093381A (ko) 반도체 검사용 프로브 카드
JP2842416B2 (ja) 半導体装置用ソケット
JP2002009207A (ja) 高周波モジュール及びその製造方法
JP2819762B2 (ja) Icソケット
US20060033511A1 (en) Interface comprising a thin pcb with protrusions for testing an integrated circuit
JPH0611620Y2 (ja) 水晶発振器
KR200244655Y1 (ko) 반도체 검사용 프로브 카드
JPS63215988A (ja) 時計用icチツプの実装構造
KR100318621B1 (ko) 대칭 구조를 갖는 접속핀을 이용한 집적회로 검사 소켓
KR20080091580A (ko) 반도체 소자 검사용 소켓 및 이를 이용한 반도체 소자검사방법
KR20090035680A (ko) 반도체 소자 검사용 소켓 조립체
KR100199854B1 (ko) 칩 스케일 패키지용 리드 프레임 및 그를 이용한 칩 스케일 패키지
JPH09219481A (ja) 面実装型ダイオードの製造方法
JPS61139052A (ja) 半導体集積回路部品
KR200229128Y1 (ko) 표면실장형 아이씨이 소켓